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19-3531; Rev 0; 12/04
KIT ATION EVALU LE B AVAILA
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
General Description
The MAX9996 high-linearity downconversion mixer provides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for 1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS base-station receiver applications. With a 1900MHz to 2400MHz LO frequency range, this particular mixer is ideal for high-side LO injection receiver architectures. Low-side LO injection is supported by the MAX9994, which is pin-for-pin and functionally compatible with the MAX9996. In addition to offering excellent linearity and noise performance, the MAX9996 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, an IF amplifier, a dualinput LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9996 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 240mA. The MAX9994/MAX9996 are pin compatible with the MAX9984/MAX9986 815MHz to 995MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9996 is also functionally compatible with the MAX9993. The MAX9996 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range.
Features
1700MHz to 2200MHz RF Frequency Range 1900MHz to 2400MHz LO Frequency Range (MAX9996) 1400MHz to 2000MHz LO Frequency Range (MAX9994) 40MHz to 350MHz IF Frequency Range 8.3dB Conversion Gain +26.5dBm Input IP3 +12.6dBm Input 1dB Compression Point 9.7dB Noise Figure 72dBc 2LO-2RF Spurious Rejection at PRF = -10dBm Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 43dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with MAX9984/MAX9986 815MHz to 995MHz Mixers Functionally Compatible with MAX9993 External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode Lead-Free Package Available
MAX9996
Applications
UMTS/WCDMA Base Stations DCS1800/PCS1900 EDGE Base Stations cdmaOneTM and cdma2000(R) Base Stations PHS/PAS Base Stations Predistortion Receivers Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems
cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group.
MAX9996ETP MAX9996ETP-T MAX9996ETP+D PART
Ordering Information
TEMP RANGE PIN-PACKAGE -40C to +85C -40C to +85C -40C to +85C PKG CODE
20 Thin QFN-EP* T2055-3 5mm x 5mm 20 Thin QFN-EP* T2055-3 5mm x 5mm 20 Thin QFN-EP* T2055-3 5mm x 5mm 20 Thin QFN-EP* T2055-3 5mm x 5mm
MAX9996ETP+TD -40C to +85C
*EP = Exposed paddle. + = Lead free. D = Dry pack. T = Tape-and-reel.
Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70C) 20-Pin Thin QFN-EP (derate 26.3mW/C above +70C)...........2.1W Note A: TC is the temperature on the exposed paddle of the package.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
JA .................................................................................+38C/W JC .................................................................................+13C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
DC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 806, R2 = 549, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.)
PARAMETER Supply Voltage Supply Current LO_SEL Input-Logic Low LO_SEL Input-Logic High SYMBOL VCC ICC VIL VIH 2 CONDITIONS MIN 4.75 TYP 5.00 206 MAX 5.25 240 0.8 UNITS V mA V V
AC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz, TC = +25C, unless otherwise noted.) (Notes 1, 2)
PARAMETER RF Frequency Range LO Frequency Range IF Frequency Range Conversion Gain Gain Variation Over Temperature Input Compression Point P1dB SYMBOL fRF fLO fIF GC PRF < +2dBm, TA = +25C TC = -40C to +85C (Note 4) Two tones: fRF1 = 2000MHz, fRF2 = 2001MHz, PRF = -5dBm/tone, fLO = 2200MHz, PLO = 0dBm, TA = +25C TC = -40C to +85C (Note 3) (Note 3) MAX9994 CONDITIONS MIN 1700 1900 1400 40 7.0 8.3 0.75 12.6 TYP MAX 2200 2400 2000 350 9.0 UNITS MHz MHz MHz dB dB dBm
Input Third-Order Intercept Point
IIP3
23.5
26.5
dBm
Input IP3 Variation Over Temperature
0.5
dB
2
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz, TC = +25C, unless otherwise noted.) (Notes 1, 2)
PARAMETER Noise Figure Noise Figure Under-Blocking LO Drive 2x2 Spurious Response at IF 3x3 LO1 to LO2 Isolation Maximum LO Leakage at RF Port Maximum LO Leakage at IF Port Minimum RF-to-IF Isolation LO Switching Time RF Port Return Loss LO1/2 port selected, LO2/1 and IF terminated LO Port Return Loss LO1/2 port unselected, LO2/1 and IF terminated IF Port Return Loss LO driven at 0dBm, RF terminated into 50, differential 200 26 20 dB 50% of LOSEL to IF settled to within 2 3LO-3RF 2LO-2RF PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm SYMBOL NF CONDITIONS Single sideband PRF = 5dBm, fRF = 2000MHz, fLO = 2190MHz, fBLOCK = 2100MHz (Note 5) -3 72 67 87 77 49 43 -20 -30 40 50 15 16 dB dB dBm dBm dB ns dB dBc MIN TYP 9.7 19 +3 MAX UNITS dB dB dBm
MAX9996
LO2 selected, 1900MHz < fLO < 2100MHz LO1 selected, 1900MHz < fLO < 2100MHz PLO = +3dBm PLO = +3dBm
Note 1: Note 2: Note 3: Note 4: Note 5:
Guaranteed by design and characterization. All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Operation outside this range is possible, but with degraded performance of some parameters. Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996
Typical Operating Characteristics
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc01
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc02
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc03
11 TC = -25C
11
11
10 CONVERSION GAIN (dB)
10 CONVERSION GAIN (dB)
10 CONVERSION GAIN (dB)
9
9
PLO = -3dBm, 0dBm, +3dBm
9
8 TC = +85C TC = +25C
8
8
VCC = 4.75V, 5.0V, 5.25V
7
7
7
6 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
6 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
6 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc04
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc05
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc06
28 27 TC = +25C 26 INPUT IP3 (dBm) 25 24 23 22 21 1500 1700 1900 2100 TC = -25C TC = +85C
28 27 INPUT IP3 (dBm) 26 25 PLO = -3dBm, 0dBm, +3dBm 24 23 22
28 27 INPUT IP3 (dBm) 26 25 24 23 22 VCC = 4.75V, 5.0V
VCC = 5.25V
2300
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1700
1900
2100
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1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc07
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc08
NOISE FIGURE vs. RF FREQUENCY
VCC = 5.25V 11 NOISE FIGURE (dB)
MAX9996 toc09
13 12 NOISE FIGURE (dB) 11 10 9 8 7 6 1500 1700 1900 2100 TC = -25C TC = +85C TC = +25C
12 PLO = 0dBm PLO = -3dBm
12
11 NOISE FIGURE (dB)
10 PLO = +3dBm 9
10
VCC = 5.0V VCC = 4.75V
9
8
8
7 2300 1500 1700 1900 2100 2300 RF FREQUENCY (MHz) RF FREQUENCY (MHz)
7 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
4
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
MAX9996
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9996 toc10
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9996 toc11
2LO-2RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm 80 2LO-2RF RESPONSE (dBc) 75 VCC = 5.25V 70 65 60 55 50 45 VCC = 4.75V VCC = 5.0V
MAX9996 toc12
85 80 2LO-2RF RESPONSE (dBc) 75 70 65 60 55 TC = -25C 50 45 1500 1700 1900 2100 PRF = -5dBm TC = +85C TC = +25C
85 80 2LO-2RF RESPONSE (dBc) 75 70 65 60 55 50 45 PLO = -3dBm PRF = -5dBm PLO = +3dBm PLO = 0dBm
85
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1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9996 toc13
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9996 toc14
3LO-3RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm 90 3LO-3RF RESPONSE (dBc) 85 80 75 70 65 60 55 VCC = 5.0V VCC = 5.25V VCC = 4.75V
MAX9996 toc15
95 PRF = -5dBm 90 3LO-3RF RESPONSE (dBc) 85 80 75 70 65 60 55 1500 1700 1900 2100 TC = -25C TC = +25C TC = +85C
95 PRF = -5dBm 90 3LO-3RF RESPONSE (dBc) 85 80 75 70 PLO = -3dBm, 0dBm, +3dBm 65 60 55
95
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1500
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1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT P1dB vs. RF FREQUENCY
MAX9996 toc16
INPUT P1dB vs. RF FREQUENCY
MAX9996 toc17
INPUT P1dB vs. RF FREQUENCY
VCC = 5.25V 14 INPUT P1dB (dBm)
MAX9996 toc18
15 TC = +85C 14 INPUT P1dB (dBm)
15
15
14 INPUT P1dB (dBm)
13 TC = +25C TC = -25C 11
13 PLO = -3dBm, 0dBm, +3dBm 12
13 VCC = 5.0V VCC = 4.75V
12
12
11
11
10 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
10 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
10 1500 1700 1900 2100 2300 RF FREQUENCY (MHz)
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9996 toc20 MAX9996 toc19
LO SWITCH ISOLATION vs. LO FREQUENCY
50 TC = -25C LO SWITCH ISOLATION (dB) 45 50
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9996 toc21
50
LO SWITCH ISOLATION (dB)
45
LO SWITCH ISOLATION (dB)
45
40
TC = +85C TC = +25C
40 PLO = -3dBm, 0dBm, +3dBm 35
40 VCC = 4.75V, 5.0V, 5.25V 35
35
30 1700 1900 2100 2300 2500 LO FREQUENCY (MHz)
30 1700 1900 2100 2300 2500 LO FREQUENCY (MHz)
30 1700 1900 2100 2300 2500 LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9996 toc22
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9996 toc23
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9996 toc24
-20 -25 -30 LO LEAKAGE (dBm) TC = -25C
-20 -25 -30 LO LEAKAGE (dBm) -35 -40 -45 -50 PLO = 0dBm PLO = -3dBm PLO = +3dBm
-20 -25 LO LEAKAGE (dBm) -30 -35 -40 VCC = 4.75V -45 -50 -55 VCC = 5.0V VCC = 5.25V
-35 -40 -45 -50 -55 -60 1700 1900 2100 2300 2500 LO FREQUENCY (MHz) TC = +25C TC = +85C
-55 -60 1700 1900 2100 2300 2500 LO FREQUENCY (MHz)
1700
1900
2100
2300
2500
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9996 toc25
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9996 toc26
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9996 toc27
-10 LO LEAKAGE AT RF PORT (dBm)
-10 LO LEAKAGE AT RF PORT (dBm)
-10 LO LEAKAGE AT RF PORT (dBm)
-15
-15
-15 VCC = 5.25V -20
-20
-20
-25
TC = -25C, +25C, +85C
-25 PLO = -3dBm, 0dBm, +3dBm -30
-25
VCC = 4.75V
VCC = 5.0V
-30 1700 1900 2100 2300 2500 LO FREQUENCY (MHz)
-30 1700 1900 2100 2300 2500 1700 1900 2100 2300 2500 LO FREQUENCY (MHz) LO FREQUENCY (MHz)
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
MAX9996
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9996 toc28
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9996 toc29
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9996 toc30
60 TC = +85C 55 RF-TO-IF ISOLATION (dB) 50 45 40 TC = -25C 35 30 1500 1700 1900 2100 TC = +25C
60 55 RF-TO-IF ISOLATION (dB) 50 45 40 PLO = -3dBm, 0dBm, +3dBm 35 30
60 55 RF-TO-IF ISOLATION (dB) 50 45 40 VCC = 4.75V, 5.0V, 5.25V 35 30
2300
1500
1700
1900
2100
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1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS vs. RF FREQUENCY
MAX9996 toc31
IF PORT RETURN LOSS vs. IF FREQUENCY
MAX9996 toc32
LO SELECTED RETURN LOSS vs. LO FREQUENCY
5 10 15 20 PLO = -3dBm 25 30 35 40 PLO = 0dBm PLO = +3dBm
MAX9996 toc33
0 5 RF PORT RETURN LOSS (dB) 10 15 20 25 30 35 40 1500 1700 1900 2100 2300 PLO = -3dBm, 0dBm, +3dBm
0 5 IF PORT RETURN LOSS (dB) 10 15 20 25 30 35 40 45 50 VCC = 4.75V, 5.0V, 5.25V
0 LO SELECTED RETURN LOSS (dB)
2500
50
100
150
200
250
300
350
1500
1700
1900
2100
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2500
RF FREQUENCY (MHz)
IF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY
MAX9996 toc34
SUPPLY CURRENT vs. TEMPERATURE (TC)
VCC = 5.25V 220 SUPPLY CURRENT (mA) 210 200 190 VCC = 5.0V 180 170 VCC = 4.75V
MAX9996 toc35
0 LO UNSELECTED RETURN LOSS (dB) 5 10 15 20 25 30 35 40 1500 1700 1900 2100 2300 PLO = -3dBm, 0dBm, +3dBm
230
2500
-30
-10
10
30
50
70
90
LO FREQUENCY (MHz)
TEMPERATURE (C)
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996
Pin Description
PIN 1, 6, 8, 14 2 3 4, 5, 10, 12, 13, 17 7 9 11 15 16 18, 19 20 EP NAME VCC RF TAP GND LOBIAS LOSEL LO1 LO2 LEXT IF-, IF+ IFBIAS GND FUNCTION Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. Ground Bias Resistor for Internal LO Buffer. Connect a 549 1% resistor from LOBIAS to the power supply. Local Oscillator Select. Logic control input for selecting LO1 or LO2. Local Oscillator Input 1. Drive LOSEL low to select LO1. Local Oscillator Input 2. Drive LOSEL high to select LO2. External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor carries approximately 100mA DC current. Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). IF Bias Resistor Connection for IF Amplifier. Connect an 806 resistor from IFBIAS to GND. Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
Detailed Description
The MAX9996 high-linearity downconversion mixer provides 8.3dB of conversion gain and 26.5dBm of IIP3, with a typical 9.7dB noise figure. The integrated baluns and matching circuitry allow for 50 single-ended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 43dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9996's inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS, cdma2000, and 2G/2.5G/3G DCS1800 and PCS1900 base stations. The MAX9996 is specified to operate over a 1700MHz to 2200MHz RF frequency range, a 1900MHz to 2400MHz LO frequency range, and a 40MHz to 350MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details.
This device can operate in low-side LO injection applications with an extended LO range, but performance degrades as f LO continues to decrease. The MAX9994--a variant of the MAX9996--provides better low-side performance since it is tuned for a lower LO range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. Input return loss is typically 15dB over the entire 1700MHz to 2200MHz RF frequency range.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or lowside injection applications with a 1900MHz to 2400MHz LO frequency range. For a device with a 1400MHz to 2000MHz LO frequency range, refer to the MAX9994 data sheet. As an added feature, the MAX9996 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. To avoid damage to the part, voltage must be applied to VCC before digital logic is applied to LOSEL. LO1 and LO2 inputs are internally matched to 50, requiring only a 22pF DCblocking capacitor. A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit).
MAX9996
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to optimize the performance for a particular frequency band. Since approximately 100mA flows through this inductor, it is important to use a low-DCR wire-wound coil. If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground.
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and NF performance is typically 26.5dBm, 72dBc, and 9.7dB, respectively.
Layout Considerations
A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9996 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2LO-2RF rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output. After the balun, the IF return loss is better than 15dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50. No matching components are required. Return loss at the RF port is typically 15dB over the entire input range (1700MHz to 2200MHz) and return loss at the LO ports is typically better than 16dB (1900MHz to 2400MHz). RF and LO inputs require only DC-blocking capacitors for interfacing.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin.
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SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996's 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9996 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT L1, L2 L3 C1 C4 C2, C6, C7, C8, C10, C12 C3, C5, C9, C11 C13, C14 C15 R1 R2 R3 T1 U1 VALUE 470nH 10nH 4pF 10pF 22pF 0.01F 150pF 150pF 806 549 7.15 4:1 balun MAX9996 DESCRIPTION Wire-wound high-Q inductors (0805) Wire-wound high-Q inductor (0603) Microwave capacitor (0603) Microwave capacitor (0603) Microwave capacitors (0603) Microwave capacitors (0603) Microwave capacitors (0603) Microwave capacitor (0402) 1% resistor (0603) 1% resistor (0603) 1% resistor (1206) IF balun Maxim IC
Pin Configuration/Functional Diagram
IFBIAS LEXT 16 GND 17 IF+ 19 IF18
20
VCC 1 RF 2 TAP 3 GND 4 GND 5 MAX9996
15 LO2 14 VCC 13 GND 12 GND 11 LO1
6 VCC
7 LOBIAS
8 VCC
9 LOSEL
10 GND
10
______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Application Circuit
MAX9996
VCC T1 3 R3 L1 C13 C14 L2 R1 IFBIAS C15 1 L3 LEXT GND IF+ IF4 2 6 IF OUTPUT
VCC
20
19
18
17
16
C3 C1 RF INPUT C5
C2
VCC RF TAP
C12 1 MAX9996 2 3 4 5 14 13 12 11 15 LO2 VCC GND GND C10 LO1 LO1 INPUT C11 LO2 INPUT VCC
C4
GND GND
6 LOBIAS VCC
7 VCC
8 LOSEL
9
10 GND
R2 VCC C6 C7 LOSEL INPUT
C8 C9
VCC
______________________________________________________________________________________
11
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
QFN THIN.EPS
L
D2 D D/2 MARKING k L E/2 E2/2 E (NE-1) X e
C L C L
b D2/2
0.10 M C A B
XXXXX
E2
PIN # 1 I.D.
DETAIL A
e (ND-1) X e
PIN # 1 I.D. 0.35x45 DETAIL B
e
L1
L
C L
C L
L
e 0.10 C A 0.08 C
e
C
A1 A3
PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
G
1
2
COMMON DIMENSIONS PKG. 20L 5x5 28L 5x5 32L 5x5 16L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. A A1 A3 b D E e k L L1 N ND NE JEDEC 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0.20 REF. 0 0.02 0.05 0.20 REF. 0 0.02 0.05 0.20 REF. 0 0.02 0.05 0.20 REF. PKG. CODES T1655-1 T1655-2 T1655N-1 T2055-2 T2055-3 T2055-4 T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1
EXPOSED PAD VARIATIONS
D2
MIN. NOM. MAX. MIN.
E2
NOM. MAX.
L
0.15
DOWN BONDS ALLOWED
3.00 3.00 3.00 3.00 3.00 3.00 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00
3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00
3.10 3.20 3.10 3.20 3.10 3.20 3.10 3.20 3.10 3.20 3.10 3.20 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20
0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.80 BSC. 0.65 BSC. 0.50 BSC. 0.50 BSC. 0.25 - 0.25 - 0.25 - 0.25 0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 16 4 4 WHHB 20 5 5 WHHC 28 7 7 WHHD-1 32 8 8 WHHD-2 -
** ** ** ** ** ** 0.40 ** ** ** ** ** ** ** 0.40 ** ** ** ** **
NO YES NO NO YES NO Y NO NO YES YES NO NO YES Y N NO YES NO NO
NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
** SEE COMMON DIMENSIONS TABLE
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3 AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
G
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.

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